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copyright ? 2013 future technology devices international limited 1 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 future technology devices international ltd . ds_ft312d ( usb android host ic ) the ft312d is a usb 2.0 full speed host ic specifically targeted at providing access to peripheral hardware from an android platform with a usb device port . the device will brid g e the usb port to a uart interface via the android open accessory protocol and has the following advanced features: ? single chip usb to uart interface. ? entire usb protocol handled on the chip . no usb specific firmware programming required. ? usb bulk transfer mode ? basic uart interface with rxd, txd, rts # , cts # pins . ? tx_active signal for controlling transceivers on rs485 interfaces . ? uart rx buffer size is 5512 bytes ? uart tx buffer size is 256 bytes ? usb _error indicator pin ? suitable for use on any android platform supporting android open accessory mode (typically 3.1 onwards, however some platforms may port open accessory mode to version 2.3.4) ? 12mhz oscillator using external crystal. ? integrated power - on - reset circuit. ? + 3 v 3 single supply operation with 5v tolerant inputs . ? usb 2.0 full speed compatible. ? e xtended operating temperature range ; - 40 ? ? ? available in compact pb - free 32 pin lqf p and qfn packages (both rohs compliant) . ? support s bulk transfer mode neither the whole nor any part of the information contained in, or the product described in this manual, may be adapted or re produced in any material or electronic form without the prior written consent of the copyright holder. this product and its documen tation are supplied on an as - is basis and no warranty as to their suitability for any particular purpose is either made or implied. future technology devices international ltd will not accept any claim for damages howsoever arising as a result of use or fa ilure of this product. your statutory rights are not affected. this product or any variant of it is not intended for use in any medical appliance, device or system in which the failure of the product might reasonably be expected to result in personal injur y. this document provides preliminary information that may be subject to change without notice. no freedom to use patents or other intellectual property rights is implied by the publication of this document. future technology devices international ltd, uni t 1, 2 seaward place, centurion business park , glasgow g41 1hh united kingdom. scotland registered company number: sc136640
copyright ? 2013 future technology devices international limited 2 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 1 typical applications ? connecting android phones to usb accessories ? connecting android tablets to usb accessories ? controlling instrum entation from android devices. ? home automation via android devices ? data logging from usb accessories ? connecting serial printing devices to android devices 1.1 part numbers part number package ft312d - 32q 1c - x 32 pin qfn ft312d - 32l 1c - x 32 pin lqfp note: packing codes for x is: - r : taped and reel, qfn 3,000pcs per reel , lqfp 1500 pcs per reel . - (no suffix) : tray packing , 26 0pcs per tray qfn, 250 pcs per tray lqfp for example: ft312d - 32 q 1c - r is 3 ,000pcs qfn taped and reel packing 1.2 usb compliant at the time of writing this datasheet, the ft312d had not complete d the usb c ompliancy t est .
copyright ? 2013 future technology devices international limited 3 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 2 ft312d block diagram figure 2 . 1 ft312d block diagram for a description of the function please refer to section 4 . u s b t r a n s c e i v e r u s b h o s t b u f f e r u a r t u s b d p u s b d m t x d r x d r t s # c t s # t x _ a c t i v e u s b _ e r r o r #
copyright ? 2013 future technology devices international limited 4 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 table of contents 1 typica l applications ................................ ................................ ...... 2 1.1 part numbers ................................ ................................ ..................... 2 1.2 usb compliant ................................ ................................ .................... 2 2 ft312d block diagram ................................ ................................ . 3 3 device pin out and signal description ................................ .......... 5 3.1 pa ckage symbol ................................ ................................ .................. 5 3.1.1 package pinout description ................................ ................................ ........................... 5 4 function description ................................ ................................ ..... 7 4.1 key features ................................ ................................ ....................... 7 4.2 functional block descriptions ................................ ............................. 7 4.2.1 uart interface module ................................ ................................ ................................ . 7 4.2.2 buffers ................................ ................................ ................................ ....................... 7 4.2.3 usb host ................................ ................................ ................................ .................... 7 4.2.4 usb transceivers ................................ ................................ ................................ ......... 7 4.3 default descriptor strings ................................ ................................ .. 7 5 uart interface ................................ ................................ ............. 9 6 usb error detection ................................ ................................ .... 10 7 absolute maximum ratings ................................ ........................ 11 7.1 dc characteristics ................................ ................................ ............. 12 7.2 esd and latch - up specifi cations ................................ ........................ 13 8 application examples ................................ ................................ . 14 8.1 usb to uartconverter ................................ ................................ ....... 1 4 8.2 usb to rs232 converter ................................ ................................ .... 15 9 package parameters ................................ ................................ ... 16 9 .1 ft312d package markings ................................ ................................ . 16 9.1.1 qfn - 32 ................................ ................................ ................................ .................... 16 9.1.2 lqfp - 32 ................................ ................................ ................................ ................... 17 9.2 ft312dpackage dimensions ................................ .............................. 18 9.2.1 qfn - 32 package dimensions ................................ ................................ ....................... 18 9.2.2 lqfp - 32 package dimensions ................................ ................................ ...................... 19 9.3 solder reflow profile ................................ ................................ ......... 20 10 contact information ................................ ................................ ... 22 appendix a C references ................................ ................................ ....................... 23 appendix b - list of figures and tables ................................ ................................ . 24 appendix c - revision history ................................ ................................ ................ 25
copyright ? 2013 future technology devices international limited 5 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 3 device pin out and signal description 3.1 package symbol figure 3 . 1 qfn schematic symbol note: t he pinout is the same for the qfn and lqfp packages. note: pin 33 on the symbol is the copper pad in the centre of the qfn package 3.1.1 package pinout description note: # denotes an active low signal. pin no. name type description 2 vcc power input 3v3 supply to ic internal 1v8 regulator 3 avcc power input 1v8 supply to ic core 1 3, 22, 28 vccio power input 3v3 supply for the io cells 7 vregout power output 1v8 output . may be used as input source for pin 3. 1,6, 14,15, 16, 19,27 gnd power input 0v ground input. table 3 . 1 power and ground 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4 u s b d p f t 3 1 2 d q f n 3 2 u s b d m g n d n c n c v c c i o t x d r x d r t s # 2 5 2 6 2 7 2 8 2 9 3 0 3 1 3 2 c t s # g n d v c c i o t x _ a c t i v e n c n c u s b _ e r r o r # g n d 3 3 1 2 3 4 5 6 7 8 9 1 0 1 1 1 2 1 3 1 4 1 5 1 6 t e s t 1 v r e g o u t g n d x t o u t x t i n a v c c v c c g n d g n d g n d g n d v c c i o n c t e s t 0 r e s e t # t e s t 2
copyright ? 2013 future technology devices international limited 6 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 pin no. name type description 4 xtin input input to 12mhz oscillator cell. connect 12mhz crystal across pins 4 and 5. 5 xtout output output from 12mhz oscillator cell. connect 12mhz crystal across pins 4 and 5. 8 test 1 input for internal use. pull to gnd 9 test2 input for factory use. pull to 3v3. 10 reset# input reset input (active low). 11 test0 output leave unterminated. 12 nc - no connect pins. leave unterminated. 17 usb d p input /output usb data signal pl us. 18 usbdm input /output usb data signal min us. 20 nc - no connect pins. leave unterminated. 21 nc - no connect pins. leave unterminated. 23 txd output transmit asynchronous data output 24 rxd input receive asynchronous data input 25 rts# output request to send control output 26 cts# input clear to send control input 29 tx_active output uart active signal (typically used with rs485 ) 30 nc - no connect pins. leave un - terminated 31 nc - no connect pins. leave un - terminated 32 usb_error# output output signal to indicate a problem with the usb connection table 3 . 2 function pins
copyright ? 2013 future technology devices international limited 7 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 4 function description the ft312d is ftdis second dedicated android open accessory mode integrated circuit device or android host . the ft312d usb host port is dedicated to support of the android open accessory class and will bridge data between this port and the u a rt interface . 4.1 key features easy to use android open accessory ic translating the device port of the android device into uart capabilities 4.2 functional block descriptions the following paragraphs de scribe each function within ft312d . please refer to the block diagram shown in figure 2 . 1 . 4.2.1 uart interface module the ft312d uart module controls the uart interface providing basic rxd, txd signalling with rts#/cts# hardware flow control . an additional tx_ acti ve signal is supplied to control external rs485 transceivers for users wishing to create a usb to rs485 bridge. the uart supports baud rates from 300 baud to 921600 b aud. a f ull description of the uart module is provided in section 5 . 4.2.2 buffers the ft312d provides internal buffering between the usb port and the uart port of the ic for smooth data streaming. the android device can send nak s to the usb out token sen t from the ft312d. this can happen when the uart application on the android is running in the background or multiple applications are launched in the android device. when the uart application o n the android device is not accepting data , the data will be buf fered in the uart rx buffer in ft312d. the uart rx buffer size is 5512 bytes . the uart _ tx buffer which stores data from the usb port, heading for the uart is 256 bytes. 4.2.3 usb host the usb host block handles the parallel - to - serial and serial - to - parallel conversion of the usb p hysical laye r . this includ es bit stuffing , crc generation . 4.2.4 usb transceivers usb transceiver cells provide the physical usb device interface supporting usb 1.1 and usb 2.0 standards. low - speed and full - speed usb data rates are supported. the output driver provide s 3v3 level slew rate control signalling, whilst a differential receiver and two single ended receivers provide usb data in , se 0 and usb reset con dition detecti on. these cells also include integrated internal pull - down resistors as required for host mode. 4.3 default descriptor strings when the usb port is connected to the android usb po r t, the android platform will determine which application to load based on the strings read from the ft312d . t hese strings are configurable with a windo ws utility : ft31 2 d_ cofiguration available for download from the ftdi website . http://www.ftdichip.com please refer to the application note an_236 user guide for ft312d configuration to chang e the default string values.
copyright ? 2013 future technology devices international limited 8 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 default values for the s trings are set in the device as per table 4 . 1 descriptor string default value manufacturer ftdi model android accessory ft312d version 1.0 serial ftdi ft312d url http://www.ftdichip.com/android.htm description ftdi android accessory ft312d table 4 . 1 default descriptor strings
copyright ? 2013 future technology devices international limited 9 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 5 uart interface t he interface implements a standard asynchronous serial uart port with flow control , for example rs232/422/485 . the uart can support b aud rates from 300 to 921600 with rts/cts flow control . the uart can support b aud rates from 300 to 115200 with no flow control . data transfer uses nrz (non - return to zer o) data format consisting of 1 s tart bit, 7 or 8 data bits, an optio nal parity bit, and one or two s top bits. when transmitting the data bits, the least significant bit is transmitted first. transmit and receive waveforms are illustrated in figure 5 - 1 and figure 5 - 2 : figure 5 - 1 uart receive waveform figure 5 - 2 uart transmit waveform baud rate (default =9600 baud) , flow control settings (default = none ) , number of data bits (default=8) , parity (default is no parity) and number of s top bits (default=1) are all co nfigurable from the android application . please refer to ftdichip document number ft_000532 for further details. http://www.ftdichip.com tx_active is transmit enable, this output may be used in rs485 designs to enab le the line driver for transmit mode . uart rx buffer size is 5512 bytes and uart tx buffer size is 256 bytes . note: uart software flow control with xon/xoff is not supported uart hardware flow control with dtr/dsr is not supported
copyright ? 2013 future technology devices international limited 10 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 6 usb error detection pin 32 of the device is provided to indicate a problem has occurred with the usb connection . the errors are usb d evice n ot s upported , usb h ub not supported and usb d evice not responding. usb device not supported would occur if the usb port was connected to a non - android class device port . e.g. t he ft312d is not designed to host memory sticks or printers etc. usb h ub not su pported would be reported if ft312d is connected to a usb hub . usb device not responding would occur if the usb device connected to the ft312d host port did not respond and the enumeration failed. the signal states are as follows: pin state definition logic 0 device connected to usb and functional logic 1 device not connected one 50ms logic 0 pulse device not responding. this pulse occurs at plug - in and then the signal returns to logic 1 . this then repeats every second . two 50ms logic 0 pulses device not supported. these pulses occur at plug - in and then the signal returns to logic 1. this then repeats every second . three 50ms logic 0 pulses hub not supported. these pulses occur at plug - in and then the signal returns to logic 1. this then repeats every second . table 6 . 1 error detection
copyright ? 2013 future technology devices international limited 11 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 7 absolute maximum ratings the absolute maximum ratings for ft312d are shown in table 7 . 1 . these are in accordance with the absolute maximum rating system (iec 60134). exceeding these may cause permanent damage to the device. parameter value unit storage temperature - 65c to 150c degrees c floor life (out of bag) at factory ambient ( 30c / 60% relative humidity) 168 hours (ipc/jedec j - std - 033a msl level 3 compliant)* hours ambient temperature (power applied) - 40c to 85c degrees c. vcc supply voltage 0 to +3.63 v vcc io 0 to +3.63 v avcc 0 to + 1.98 v dc input voltage - usbdp and usbdm - 0.5 to +(vcc +0.5) v dc input voltage - high impedance bidirectional - 0.5 to +5.00 v dc input voltage - all other inputs - 0.5 to +(vcc +0.5) v dc output current - outputs 4 ma dc output current - low impedance bidirectional 4 ma table 7 . 1 absolute maximum ratings * if devices are stored out of the packaging beyond this time limit the devices should be baked before use. the devices should be ramped up to a temperature of 125c and baked for up to 17 hours.
copyright ? 2013 future technology devices international limited 12 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 7.1 dc characteristics dc characteristics (ambient temperature - 40?c to +125 ?c) parameter description minimum typical maximum units conditions vcc1 vcc operating supply voltage 2.97 3.3 3.63 v vcc2 vccio operating supply voltage 2.97 3.3 3.63 v avcc vcc_pll operating supply voltage 1.62 1.8 1.98 v icc1 operating supply current 48mhz 25 ma normal operation icc2 operating supply current 128 a usb suspend table 7 . 2 operating voltage and current parameter description minimum typical maximum units conditions voh output voltage high 2.4 v i source = 8ma vol output voltage low 0.4 v i sink = 8ma vin input switching threshold 1.5 v table 7 . 3 i/o pin characteristics parameter description minimum typical maximum units conditions uvoh i/o pins static output ( high) 2.8 v uvol i/o pins static output ( low ) 0.3 v uvse single ended rx threshold 0.8 2.0 v ucom differential common mode 0.8 2.5 v
copyright ? 2013 future technology devices international limited 13 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 parameter description minimum typical maximum units conditions uvdif differential input sensitivity 0.2 v udrvz driver output impedance 3 6 9 ohms table 7 . 4 usb i/o pin (usbdp, usbdm) characteristics parameter description minimum typical maximum units conditions vcck power supply of internal core cells and i/o to core interface 1.62 1.8 1.98 v 1.8v power supply vcc18io power supply of 1.8v osc pad 1.62 1.8 1.98 v 1.8v power supply t j operating junction temperature - 40 25 125 c i in input lea kage current - 10 1 10 a i in = vcc18io or 0v i oz tri - state output leakage current - 10 1 10 a table 7 . 5 crystal oscillator 1.8 volts dc characteristics 7.2 esd and latch - up specifications description specification human body mode (hbm) 2000v machine mode (mm) 200v charged device mode (cdm) 500v latch - up > 200ma table 7 . 6 esd and latch - up specifications
copyright ? 2013 future technology devices international limited 14 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 8 application examples the following sections illustrate possible applications of the ft312d . 8.1 usb to uart converter figure 8 . 1 application example showing usb to uart converter the uart signals are at 3v3 level and may be used to drive directly into a fpga or mcu with a 3v3 interface, or could be level shifted with an rs232, rs422 or rs485 transceiver. the tx_active signal is used mostly with rs485 transceivers to enable the t ra nsmit line drivers . the unused pins may be left unterminated. f t 3 1 2 d 1 2 3 4 5 s h i e l d f e r r i t e b e a d g n d g n d 3 v 3 g n d v c c i o v r e g o u t u s b d m u s b d p a v c c g n d r e s e t # 1 0 0 n f 1 0 0 n f 4 . 7 u f + t x _ a c t i v e 5 v p o w e r t o u s b v c c 3 v 3 r e g u l a t o r 5 v 2 7 r 2 7 r 1 0 0 n f 3 v 3 t x d r x d r t s # c t s # u s b _ e r r o r g n d 4 7 p f 4 7 p f m c u / f p g a u a r t _ t x d u a r t _ r x d u a r t _ r t s # u a r t _ c t s # u a r t _ t x _ a c t i v e 6 2 0 r 3 v 3 l e d
copyright ? 2013 future technology devices international limited 15 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 8.2 usb to rs232 converter figure 8 . 2 application example showing usb to rs232 converter an example of using the ft312d as a usb to rs232 converter is illustrated in figure 8.2. in this application, a ttl to rs232 level converter ic is used on the serial uart interface of the ft312d to convert the ttl levels of the ft312d to rs232 levels. this level shift can be done using line drivers from a variety of vendors e.g. zywyn. a suitable level shifting device is the zywyn zt3243f which is capable of rs232 communication at up to 1000k baud. the unused pins may be left unterminated. f t 3 1 2 d 1 2 3 4 5 s h i e l d f e r r i t e b e a d g n d g n d 3 v 3 g n d v c c i o v r e g o u t u s b d m u s b d p a v c c g n d r e s e t # 1 0 0 n f 1 0 0 n f 4 . 7 u f + t x _ a c t i v e 5 v p o w e r t o u s b v c c 3 v 3 r e g u l a t o r 5 v 2 7 r 2 7 r 1 0 0 n f 3 v 3 t x d r x d r t s # c t s # u s b _ e r r o r g n d 4 7 p f 4 7 p f u a r t _ t x d u a r t _ r x d u a r t _ r t s # u a r t _ c t s # r s 2 3 2 l e v e l c o n v e r t e r t x d r x d r t s c t s 2 3 7 8 d b 9 6 2 0 r 3 v 3 l e d 5 1 0 s h i e l d
copyright ? 2013 future technology devices international limited 16 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 9 package parameters ft312d is available in rohs compliant packages, qfn package (32qfn) and an lqfp package (32lqfp) . the package s are lead (pb) free and use a green compound. the package is fully compliant with european union directive 2002/95/ec. the mechanical drawing s o f the packages are shown in sections 9.2 - all dimensions are in millimetres. the solder reflow profile for all packages can be viewed in section 9.3 . 9.1 ft312d package markings 9.1.1 qfn - 32 an example of the markings on the qfn package are shown in figure 9 - 1 . the ftdi part number is too long for the 32 qfn package so in this case the last two digits are wrapped down onto the date code line. figure 9 - 1 qfn package markings 1c should be printed on line 4, then a space and then the date code. 1. yyww = date code, where yy is year and ww is week number 2. marking align ment should be centre justified 3. laser marking should be used 4. all marking dimensions should be marked proportionally. marking font should be using unisem standard font (roman simplex) ft di i xxxxxxxx ft312d - 32q line 1 C ftdi logo l ine 4 C revision and date code l ine 2 C wafer lot number 1 32 l ine 3 C ftdi part number 1c yyww
copyright ? 2013 future technology devices international limited 17 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 9.1.2 lqfp - 32 an example of the markings on the lqfp package are shown in figure 9 - 2 . figure 9 - 2 lqfp package markings notes: 1. yyww = date code, where yy is year and ww is week number 2. marking alignment should be centre justified 3. laser marking should be used 4. all marking dimensions should be marked proportionally. marking font should be using unisem standard font (roman simplex) ft d i xxxxxxxxxx ft312d - 32l line 1 C ftdi logo l ine 4 C revision, date code l ine 2 C wafer lot number 1 32 l ine 3 C ftdi part number 1c yyww
copyright ? 2013 future technology devices international limited 18 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 9.2 ft312d package dimensions 9.2.1 qfn - 32 package dimensions figure 9 - 3 qfn - 32 package dimensions note: dimensions are in mm note: the centre pad should be conne c ted to the gnd plane for improved thermal conduction and noise immunity. 1 x x x x x x x x f t d l 1 c y y w w f t 3 1 2 d - 3 2 q 1
copyright ? 2013 future technology devices international limited 19 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 9.2.2 lqfp - 32 package dimensions figure 9 - 4 lqfp - 32 package dimensions note: dimensions are in mm f t d l x x x x x x x x 1 c y y w w f t 3 1 2 d - 3 2 l p i n # 1 p i n # 3 2
copyright ? 2013 future technology devices international limited 20 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 9.3 solder reflow profile figure 9 - 5 all packages reflow solder profile
copyright ? 2013 future technology devices international limited 21 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 profile feature pb free solder process (green material) snpb eutectic and pb free (non green material) solder process average ramp up rate (t s to t p ) 3c / second max. 3c / second max. preheat - temperature min (t s min.) - temperature max (t s max.) - time (t s min to t s max) 150c 200c 60 to 120 seconds 100c 150c 60 to 120 seconds time maintained above critical temperature t l : - temperature (t l ) - time (t l ) 217c 60 to 150 seconds 183c 60 to 150 seconds peak temperature (t p ) 260c see figure 9 - 5 time within 5c of actual peak temperature (t p ) 30 to 40 seconds 20 to 40 seconds ramp down rate 6c / second max. 6c / second max. time for t= 25c to peak temperature, t p 8 minutes max. 6 minutes max. table 9 . 1 reflow profile parameter values snpb eutectic and pb free (non green material) package thickness volume mm3 < 350 volume mm3 >=350 < 2.5 mm 235 +5/ - 0 deg c 220 +5/ - 0 deg c 2.5 mm 220 +5/ - 0 deg c 220 +5/ - 0 deg c pb free (green material) = 260 +5/ - 0 deg c table 9 . 2 package reflow peak temperature
copyright ? 2013 future technology devices international limited 22 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 10 contact information head office C glasgow, uk future technology devices international limited unit 1, 2 seaward place, centurion business park glasgow g41 1hh united kingdom tel: +44 (0) 141 429 2777 fax: +44 (0) 141 429 2758 e - mail (sales) sales 1 @ftdichip.c om e - mail (support) support 1 @ftdichip.com e - mail (general enquiries) admin1@ftdichip.com branch office C taipei, taiwan future technology devices international limited (taiwan) 2f, no. 516, sec. 1, neihu road taipei 114 taiwan, r.o.c. tel: +886 (0) 2 8791 3570 fax: +886 (0) 2 8791 3576 e - mail (sales) tw.sales1@ftdichip.com e - mail (support) tw.support1@ftdichip.com e - mail (general enquiries) tw.admin1@ftdichip.com branch office C oregon, usa future technology devices international limited (usa) 7130 sw fir loop tigard, or 97223 usa tel: +1 (503) 547 0988 fax: +1 (503) 547 0987 e - mail (sales) us.sales@ftdichip.com e - mail (support) us.support@ftdichip.com e - mail (general enquiries) us.admin@ftdichip.com branch office C shanghai, china room 1103, no. 666 west huaihai road, shanghai, 200052 china tel: +86 21 62351596 fax: +86 21 62351595 e - mail (sales) cn.sales@ftdichip.com e - mail (support) e - mail (general enquiries ) cn.support@ftdichip.com cn.admin@ftdichip.com
copyright ? 2013 future technology devices international limited 23 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 appendix a C references useful links http://www.ftdichip.com/support/documents/white_papers/wp_001_connecting_%20peripherals_to_an _android_%20platform.pdf
copyright ? 2013 future technology devices international limited 24 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 a ppendix b - list of figures and tables list of figures figure 2.1ft312d block diagram ................................ ................................ ................................ .... 3 figure 3.1qfn schematic symbol ................................ ................................ ................................ ... 5 figure 5 - 1 uart receive waveform ................................ ................................ ................................ 9 figure 5 - 2 uart transmit waveform ................................ ................................ .............................. 9 figure 8.1application example showing usb to uart converter ................................ ....................... 14 figure 8.2 application example showing usb to rs232 converter ................................ ...................... 15 figure 9 - 1qfn package markings ................................ ................................ ................................ .. 16 figure 9 - 2 lqfp package markings ................................ ................................ ................................ 17 figure 9 - 3 qfn - 32 package dimensions ................................ ................................ ........................ 18 figure 9 - 4lqfp - 32 package dimensions ................................ ................................ ........................ 19 figure 9 - 5 all packages reflow solder profile ................................ ................................ ................. 20 list of tables table 3.1 power and ground ................................ ................................ ................................ .......... 5 table 3.2 function pins ................................ ................................ ................................ ................. 6 table 4.1default descriptor strings ................................ ................................ ................................ . 8 table 6.1 error detection ................................ ................................ ................................ ............. 10 table 7.1 absolute maximum ratings ................................ ................................ ............................ 11 table 7.2operating voltage and current ................................ ................................ ........................ 12 table 7.3i/o pin characteristics ................................ ................................ ................................ .... 12 table 7.4usb i/o pin (usbdp, usbdm) characteristics ................................ ................................ ... 13 table 7.5crystal oscillator 1.8 volts dc characteristics ................................ ................................ ... 13 table 7.6 esd and latch - up specifications ................................ ................................ ..................... 13 table 9.1re flow profile parameter values ................................ ................................ ...................... 21 table 9.2 package reflow peak temperature ................................ ................................ .................. 21
copyright ? 2013 future technology devices international limited 25 ds_ft312d usb android host ic datasheet version 1.0 document no.: ft_000816 clearance no.: ftdi# 331 appendix c - revision history document title: usb android host ic ds_ft312d document reference no.: ft_000816 clearance no.: ftdi# 331 product page: http://www.ftdichip.com/ftproducts.htm document feedba ck: send feedback version 1.0 initial release feb 201 3

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